Robert Triggs / Android Authority
TL;DR
- Samsung is reportedly engaged on a brand new cooling resolution for future Exynos smartphone processors.
- This packaging tech is seemingly derived from PCs and servers and sees a sort of heatsink hooked up to the highest of the processor.
- Work on the tech may very well be accomplished by This autumn 2024, suggesting the Exynos 2500 may probably use it.
The Exynos 2400 is a good flagship processor, though we did discover it ran a bit hotter than the Snapdragon 8 Gen 3. Now, it seems like Samsung has a brand new cooling resolution up its sleeve for future Exynos smartphone chipsets.
The Elec stories that Samsung is engaged on a brand new chip packaging know-how referred to as fan-out wafer-level package-HPB (FOWLP-HPB). This tech entails attaching a sort of heatsink, referred to as a warmth path block (HPB), to the highest of the chipset.
The outlet stories that this heatsink know-how is derived from PCs and servers, and is anticipated for use on future Exynos processors. The web site added that the tech is just arriving on smartphones now as a result of their smaller type issue, suggesting that miniaturizing the know-how was a problem.
It’s believed that growth of the tech will probably be accomplished by This autumn 2024, opening the door to mass manufacturing thereafter. This timeline means that the Exynos 2500, anticipated for use in some Galaxy S25 fashions, may very well be geared up with this cooling tech supplied that growth wraps up early in This autumn.
The Exynos 2400 ran a bit hotter than the Snapdragon 8 Gen 3 in our personal testing. In the meantime, 2022’s Exynos 2200 fared even worse, that includes main throttling points. So this packaging know-how can be a welcome addition to future Exynos chips if it really works as meant, opening the door to extra constant efficiency, higher battery life, and cooler telephones.