The packaging for Intel’s Core i9-13900K processor has been leaked, and whereas the spilled photograph exhibits that it follows the identical theme as the prevailing 12900K – together with that wafer – there are some slight, however nonetheless fascinating, adjustments.
The field for the Core i9-13900K was posted on Twitter by well-known leaker HXL, who acquired it from a closed WeChat group, as VideoCardz (opens in new tab) factors out (and naturally, keep skeptical round whether or not that is real or not, as ever).
i9k（Thirteenth） PackagingSource: WeChat pic.twitter.com/ffQIf2KSZ1September 23, 2022
As you’ll be able to see, there are some notable adjustments right here, and whereas Intel has nonetheless put the processor in a flowery mock silicon wafer case, this time round, moderately than gold, it’s coloured silver.
Moreover, the field itself is quite a bit thinner than the one which carries the current-gen Alder Lake flagship, though in any other case, the design stays fairly related.
Evaluation: Raptor Lake leaks are gathering momentum, for certain
What’s most fascinating right here, in fact, is the truth that getting a glimpse of the field of the Raptor Lake flagship signifies that possibly Intel’s next-gen chips are usually not too distant from launch now. Notably as we simply noticed the Core i9-13900K in leaked PassMark benchmarks, so the spillage round these Thirteenth-gen processors seems to be choosing up momentum.
Rumor has it that Raptor Lake CPUs shall be launched subsequent week, doubtless on September 27, however the silicon received’t go on sale till October. These leaks beginning to pop up increasingly more proper now’s a hopeful indication that we’d simply see these processors sooner in October, moderately than later.
So far as the packaging itself goes, altering from a gold wafer to silver appears an odd selection for Intel, suggesting one thing of a downgrade, at the least subliminally. You get a silver medal for second place, in any case, and gold for the highest spot. It’s good to see a slimmer field when it comes to conserving issues a bit extra environmentally-friendly, as properly; though that stated, the extra wafer packaging is moderately pointless, and never so ecologically sound in that respect.
We’ve a sense that the wafer gimmick is getting its final outing right here, and it could make sense for Intel to do a whole field redesign for the subsequent era of processors in 2023, which shall be Meteor Lake (as this shall be an enormous change with the drop to 7nm, lastly).
