Introduced at CES, the platform is designed to concurrently help digital cockpit and superior driver-assistance programs.
Driving additional towards the following era of cars, Qualcomm Applied sciences on Tuesday introduced the Snapdragon Journey Flex system-on-chip, which is engineered to help mixed-critical workloads throughout blended compute assets.
The purpose is to permit the digital cockpit, superior driver help programs and automatic driving features to coexist on a single SoC, in accordance with the corporate, which made the announcement at CES. Snapdragon Journey Flex is the most recent addition to the corporate’s Snapdragon Digital Chassis product portfolio.
Snapdragon Flex SoC’s capabilities
Designed to fulfill the best degree of automotive security, the Flex SoC goals to allow a {hardware} structure to help isolation, freedom from interference and high quality of service for particular ADAS features. It comes outfitted with a devoted automotive Security Integrity Degree D security island.
The Flex SoC additionally integrates a software program platform that helps a number of working programs working concurrently, hypervisor enablement with remoted digital machines and a real-time working system with an automotive open system structure.
In response to Qualcomm, this provides the Flex SoC the capabilities to fulfill the mixed-criticality workload necessities for driver help security programs, digital reconfigurable clusters, infotainment programs, driver monitoring programs, and park-assist programs.
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The Flex SoC is built-in with the Snapdragon Journey Imaginative and prescient stack, which is designed to allow extremely scalable and protected driver help and automatic driving experiences utilizing a entrance digital camera to fulfill regulatory necessities. It is usually meant to allow multi-modal sensors, equivalent to a number of cameras, radars, lidars and maps, for an enhanced notion that creates an environmental mannequin across the automobile feeding into automobile management algorithms.
The Snapdragon Journey Imaginative and prescient stack meets the New Automobile Evaluation Program necessities and Europe’s Common Security Rules whereas scaling as much as larger ranges of autonomy, the corporate stated.
Qualcomm leveraged its background in growing open, scalable, high-performance and power-efficient automotive choices in designing the Flex SoC household to be suitable with the broader portfolio of SoCs inside the Snapdragon Digital Chassis Platform, the corporate stated.
Designed for advanced use circumstances
The purpose was to optimize Flex SoC for efficiency scalability, starting from entry-level to premium, high-end central-compute programs, Qualcomm stated. It will give automakers the pliability to decide on the suitable efficiency level for his or her automobile tiers.
Additional, Flex SoC is designed to allow automakers to sort out advanced cockpit use circumstances, equivalent to built-in instrument clusters with immersive high-end graphics, infotainment and gaming shows, and rear seat leisure screens, concurrently with latency-critical premium audio expertise and the built-in Snapdragon Journey Imaginative and prescient stack. These efficiency necessities may be realized by using {hardware} and software program codesign, Qualcomm stated.
The Flex SoC can also be designed to be a really perfect in-vehicle central-compute platform to energy the next-generation software-defined automobile choices by offering high-performance, protected compute with the power to execute blended essential cloud-native workloads. The in-vehicle compute is complemented by platform software program able to being deployed on a containerized infrastructure, in accordance with Qualcomm.
Aiming to assist automakers transition to an built-in, open, and scalable structure throughout all autos
The Flex SoC is supported by a cloud-native automotive software program improvement workflow, which incorporates help for digital platform simulation that may be built-in as a part of in-cloud DevOps and machine studying operations infrastructure.
The primary Snapdragon Journey Flex SoC is sampling now for an anticipated begin of manufacturing starting in 2024.
“As we enter the period of software-defined autos, the Snapdragon Journey Flex SoC household defines a brand new setpoint for high-performance, power-optimized, mixed-criticality architectures,” stated Nakul Duggal, senior vice chairman and common supervisor of automotive at Qualcomm.
Duggal stated the purpose is to make it “simpler and cheaper for automakers and Tier-1s to embrace the transition to an built-in, open, and scalable structure throughout all automobile tiers with our pre-integrated suite of {hardware}, software program, and ADAS/AD stack options.” On the identical time, Qualcomm goals to allow “the ecosystem to distinguish on our platforms with an accelerated time-to-market benefit.”
