One thing to look ahead to: There have been numerous revelations at Intel’s Innovation 2023 occasion, together with affirmation that the corporate will observe the same path as AMD by utilizing 3D-stacked cache designs in its processors. The know-how will not seem in Meteor Lake, however it will likely be prepared for future shopper and enterprise CPUs.
Throughout a Q&A session at Innovation 2023, Intel CEO Pat Gelsinger was requested if the corporate would imitate AMD and use a chip-stacking method that has proved extremely popular in its 3D V-Cache processors just like the Ryzen 7 7800X3D.
“Whenever you reference V-Cache right here, you are speaking a couple of very particular know-how that TSMC does with a few of its clients as nicely. Clearly, we’re doing that in another way, proper?” mentioned Gelsinger, through Tom’s {Hardware}.
The CEO mentioned there will probably be no 3D V-Cache-style tech used within the Meteor Lake chips arriving this December, however did add that “in our roadmap, you are going to see this concept of the 3D silicon, the place we’ll have cache on one die, proper? After which we’ll have CPU compute on a stacked die, on high of it.”
Gelsinger mentioned Intel plans to attach chip dies vertically utilizing its EMIB and Foveros processes, “so we really feel excellent that now we have superior capabilities for next-generation reminiscence architectures.” He added that the know-how will probably be utilized in Intel’s personal merchandise and likewise be obtainable to Foundry (IFS) clients.
AMD’s second technology of 3D V-Cache chips, primarily based on TSMC’s SoIC know-how, launched earlier this 12 months. The corporate confirmed that Zen 4 makes use of as much as three nodes: the 5 nm node for the CCD, the 6 nm node for the IO die, and the 7 nm node for the V-Cache. The corporate defined the benefits of the brand new technology and among the challenges throughout its ISSCC presentation in March.
Information that Intel will probably be embracing 3D-stacked cache will probably be welcomed by gaming followers of Crew Blue. AMD’s Ryzen 7 7800X3D and Ryzen 9 7950X3D are two of the quickest chips on the market for video games due to the bigger on-package cache, as proven by our benchmarks.
Precisely when Intel’s chip-stacking tech will arrive is unclear, past it being after Meteor Lake. It might seem in Arrow Lake, Lunar Lake, and/or Panther Lake, which is due in 2025, nevertheless it’s doable that we is likely to be ready even longer to see what Intel provides as a rival to AMD’s V-Cache processors.
