Investigating AMD’s Recent AM5 AGESA Updates on ASRock’s X670E Taichi

It is protected to say that the final couple of weeks have been a bit chaotic for AMD and its motherboard companions. Sadly, it has been much more chaotic for some customers with AMD’s Ryzen 7000X3D processors. There have been a number of experiences of Ryzen 7000 processors burning up in motherboards, and in some circumstances, burning out the chip socket itself and taking the motherboard with it.

Over the previous few weeks, we have lined the difficulty because it’s unfolded, with AMD releasing two official statements and motherboard distributors scrambling to make sure their customers have been updating firmware in what seems like a grab-it-quick fireplace sale, pun very a lot meant. Not every little thing has been going based on plan, with AMD having launched two new AGESA firmware updates by its motherboard companions to try to deal with the problems inside every week.

The primary firmware replace made accessible to distributors, AGESA 1.0.0.6, addressed experiences of SoC voltages being too excessive. This AGESA model put restrictions in place to restrict that voltage to 1.30 V, and was rapidly distributed to all of AMD’s companions. Extra just lately, motherboard distributors have pushed out even newer BIOSes which embrace AMD’s AGESA 1.0.0.7 (BETA) replace. With much more safety-related adjustments made beneath the hood, that is the firmware replace AMD and their motherboard companions are pushing customers to put in to alleviate the problems – and stop new ones from occurring.

On this article, we’ll be having a look on the results of all three units of firmware (AGESA 1.0.0.5c – 7) operating on our ASRock X670E Taichi motherboard. The purpose is to uncover what, if any, adjustments there are to variables utilizing the AMD Ryzen 9 7950X3D, together with SoC voltages and present drawn beneath intensive reminiscence primarily based workloads.

Right here is our latest protection of the Ryzen 7000X3D/7000 ‘burnout’ points, together with two statements from AMD, an official response from ASUS and MSI:

AMD Ryzen 7000 AGESA Firmware: From 1.0.0.5c to 1.0.0.7 Inside 32 Days

The primary firmware replace made accessible to distributors, AGESA 1.0.0.6, addressed experiences of SoC voltages being too excessive, with new restrictions put in place to restrict issues to 1.30 V. Within the case of the board we have been utilizing to try to dig deeper into points, the ASRock X670E Taichi, this was made accessible to the general public on 4/27/23 by its 1.21 firmware replace. Extra just lately, on 5/4/23, ASRock made its newest 1.24.AS02 firmware, which incorporates AMD’s AGESA 1.0.0.7 (BETA) replace.

The AGESA 1.0.0.7 (BETA) replace is the firmware that AMD has been planning to roll out most just lately to alleviate the problems of burnout, not only for Ryzen 7000X3D chips with 3D V-Cache, but in addition throughout the broader Ryzen 7000 and AM5 ecosystem. In between the preliminary AGESA 1.0.0.5c firmware that introduced AMD’s Ryzen 7000X3D assist to AM5 motherboards, within the house of a mere 32 days, AMD has launched a complete of three main AGESA variations, which ASRock has dutifully printed for the X670E Taichi. We’ll be utilizing this as our baseline for our evaluation and look into what is going on on.

On prime of this, AMD can also be planning to launch an much more robustly up to date AGESA firmware, which could possibly be within the coming weeks. Referred to internally as AGESA 1.0.0.9, we did attain out to AMD for touch upon this, however our rep could not touch upon “unannounced or inside solely software program stacks.” It must also be famous that the present firmware on the time of writing accessible to customers is a BETA model, implying {that a} newer AGESA is undoubtedly on its means. Nonetheless, the timescale of the discharge is anybody’s guess presently.

So trying on the variations in AMD’s AGESA updates over the past month, there hasn’t been any official indication of adjustments aside from the naked minimal, no less than not from ASRock’s descriptions. The next is what ASRock is saying in regards to the descriptions of the AGESA updates:

• AGESA 1.0.0.5c: Preliminary assist for Ryzen 7000X3D processors with 3D V-Cache.
• AGESA 1.0.0.6 (BETA): Improved reminiscence compatibility, Optimizations for Ryzen 7000X3D, beneficial replace for Ryzen 7000X3D processors.
• AGESA 1.0.0.7 (BETA): Help for 48/24GB DDR5 reminiscence modules.

The outline of the adjustments, no less than from the purpose of ascertaining what every AGESA is providing, is borderline pitiful. In not one of the descriptions does it state what adjustments AMD has made to every AGESA firmware to deal with the present points, which in all honesty, is a reasonably large factor to omit. There are not any indications in any respect on ASRock’s X670E Taichi BIOS web page as to what every firmware adjustments, and with no public notes accessible to customers, it is a case of “replace to this firmware, it is beneficial.”

So what do we all know in regards to the adjustments? Properly, we all know the important change going from AGESA 1.0.0.5c to the 0.6 and 0.7 variations is a lockdown on SoC voltage to 1.30 V. Beforehand, on the ASRock X670E Taichi with 1.0.0.5c; we had been capable of set the SoC voltage to 2.5 V, which might nearly definitely lead to frying our X3D chips like an egg.

Picture Credit score: Igor Wallossek, Igorslab.de

The opposite adjustments coming with AGESA 1.0.0.6, based on Igor Wallosek, the Editor-in-chief of Igorslab.de, AMD has additionally added two new PROCHOT entries that time on to combating overheating. PROCHOT basically means Processor Scorching, and it’s a managed mechanism that’s designed to guard the processor from overheating. There are two implementations right here. The primary is the PROCHOT Management mechanism which is exactly what it says on the tin. When the CPU hits an outlined worth, the element sends a PROCHOT Management sign, and the CPU attracts much less energy to try to mitigate temperatures and cut back the chance of harm. 

The second mechanism is PROCHOT Deassertion Ramp Time, which dictates how lengthy a processor can ramp up the ability after the preliminary PROCHOT Management sign has been disabled. Basically, PROCHOT Deassertion Ramp is the time it takes for the processor to get again as much as regular parameters, and totally different variables, together with cooling, the aggressiveness of stated cooling, and basic warmth dissipation high quality, can dictate this time. If the processor is inadequately cooled, this can lead to an extended deassertion ramp time, whereas extra aggressive warmth dissipation strategies ought to theoretically permit for a faster ramp-up time.

The Story So Far: Players Nexus Deep-Dive – The Ryzen 7000 CORE Elementary Points

Earlier than the rollout of latest firmware, Steve Burke, the Editor-in-Chief of Players Nexus, and his workforce investigated the problems in-depth, together with trying on the authentic fried {hardware} from Speedrookie. This consists of a defective and bulged out Ryzen 7 7800X3D processor and his burnt ASUS ROG STRIX X670E E Gaming motherboard. As a substitute of RMA’ing the {hardware}, Steve Burke reached out to the person and provided to purchase the {hardware} from him, minimizing the RMA lead time and permitting Speedrookie to buy new {hardware}.

The 38:46 lengthy video is an excellent watch, and we definitely suggest that customers watch this, particularly for these extra within the inside workings (or points) of the Ryzen 7000X3D and 7000 sequence processors. To summarize Steve’s findings, we took away the next factors:

• AMD Ryzen 7000X3D CPUs are shutting down too late to mitigate bodily injury.
• ASRock, GIGABYTE, and MSI have a 116°C thermal journey level, and ASUS has 106°C, however typically did not work as meant.
• The thermal cut-off for Ryzen 7000X3D is meant to be 106°C and 116°C for Ryzen 7000.
• AMD EXPO enabled on ASUS is 1.35V on SoC voltage up till BIOS 1202 (AGESA 1.0.0.6).
• ASUS’s SoC Voltage settings had been/are too excessive.
• The AGESA firmware rollout has been nothing in need of chaos at this level.
• AMD is providing RMA (paying delivery each methods) on killed CPUs, even when EXPO has been used (no less than within the US)
• No phrase on if motherboard distributors will honor the guarantee (on the time of writing)

Whereas Steve and his workforce at Players Nexus have gone deep into uncovering the basis causes of the issue, one factor stays abundantly clear: the difficulty is not only one which pertains to SoC voltage. There has definitely been some confusion between AMD themselves and its motherboard companions in implementing the suitable failsafe to forestall the CPU (and motherboard socket, for that matter) from burning into oblivion.

The opposite drawback pertains to ASUS right here, with a extra aggressive implementation of its SoC voltages, which Players Nexus confirmed of their testing as operating too excessive. Earlier than the AGESA firmware (1.0.0.6) replace by BIOS model 1202, ASUS was overshooting SoC voltage by 0.05 V over AMD’s newly imposed SoC voltage restrict of 1.3 V.

Picture Credit score: Players Nexus

Soldering leads and connecting the motherboard to a digital multimeter, a 1.35 V SoC setting throughout the ASUS firmware (and with EXPO enabled) resulted in an noticed 1.398 V from an SoC pad. This was usually even increased when probed on the choke, at an eye-watering 1.42 V. This essentially poses an issue that ASUS’s firmware and the SoC rails themselves aren’t cohabiting effectively with one another. An extra 0.05 V on prime of the beneficial 1.30 V is lots, to say the least, however including an additional 0.05 V on prime of that can undoubtedly result in dielectric degradation and presumably result in useless CPUs and burnt motherboard sockets.

Performing some preliminary testing on the impact of SoC voltage on stability on the newest AGESA 1.0.0.7 (BETA) firmware, our G.Ability DDR5-6000 equipment of DDR5 reminiscence (2 x 16 GB) on the ASRock X670E Taichi would robotically preset 1.30 V on the SoC when making use of the EXPO reminiscence profile. To elaborate, sadly, we tried 1.15 V, which was a no-go, and even 1.20 V was a no-go. We ultimately settled on 1.25 V on the SoC for this equipment and our Ryzen 9 7950X3D, and we discovered stability in memory-intensive benchmarks was strong.

Maybe one of many largest issues to come back exterior of Players Nexus’s testing was that AMD is now providing RMA assist for customers who’ve used EXPO reminiscence profiles, one thing which usually voids the guarantee on AMD’s processors. Whether or not or not different areas intend to honor these RMA requests hasn’t been confirmed, but it surely’s unlikely to be a difficulty.

Nonetheless, it is a good gesture for customers with broken CPUs from a difficulty that’s solely not their fault. Motherboard distributors, alternatively, function inside their insurance policies and parameters, and it could be trickier getting an RMA on a broken motherboard just because AMD does not management motherboard distributors’ RMA insurance policies. We might hope in good religion that motherboard distributors will honor the guarantee in situations of those burnout points, however we can’t affirm if they may presently.

Our Testing: Methodology, Check Setup, and {Hardware}

To summarize the rationale for testing AMD’s AGESA firmware, we aren’t attempting to replicate burning our Ryzen 7000X3D samples – sufficient processors have already been sacrificed for science. For that matter, we definitely did not see or odor any smoke coming from our ASRock X670E Taichi throughout testing, so we’ll take that as a great signal.

Our function for testing is to spotlight any variations or variations in parameters and power-related parts coming from AMD’s newest AGESA packages. This consists of taking a look at rails like SoC voltage and Bundle Energy Monitoring (PPT) output from the AM5 CPU socket. As AMD has dialed down what customers and motherboard distributors can apply with reference to SoC voltage to 1.30 V, it is value noting that every one of ASRock’s firmware we have examined on the X670E Taichi on this piece robotically units SoC voltage to 1.30 V.  Whereas we do not have the required instruments and gear to solder results in the motherboard to watch ‘bodily’ voltages, we’re counting on HWInfo’s reporting prowess, in addition to taking a look at a number of temperatures.

We additionally did some in-house stability testing towards the brand new SoC voltage limits, operating a contemporary batch of assessments on our Ryzen 9 7950X3D paired with a G.Ability DDR5-6000 (2 x 16 GB) reminiscence equipment with its AMD EXPO reminiscence profile enabled. We discovered that issues weren’t steady till we utilized 1.25 V on the SoC voltage throughout the firmware. Hitting as much as 1.25V on the SoC, our equipment was rock strong, even in memory-intensive workloads and benchmarks.

That has been our focus, attempting to push the reminiscence as arduous as we will to make sure full stability. A number of the fanfare surrounding the difficulty, on the entire, has been unfairly placed on AMD’s EXPO profiles as being one of many causes; it isn’t. We all know that CPU-intensive workloads will generate extra warmth, however that is not what we have been taking a look at investigating. We’re in search of variations in present and energy between the totally different firmware variations to see if AMD (and ASRock) has made optimizations inside its framework to cut back these elements, with present, or extra particularly over present and the built-in failsafes being bypassed, which is among the key considerations within the burnouts.

Our check bench for our AGESA (AM5) replace testing is as follows:

For our alternative of workloads, we’re counting on the Reminiscence Check Suite from Openbenchmarking.org by way of Phoronix to implement our memory-intensive workloads. Though a few of these workloads aren’t optimized and do not run on Home windows, we used the CacheBench benchmark, which makes use of a number of knowledge varieties throughout learn, write, modify, and skim/write/modify mixed. As a part of the LLCbench low-level architectural characterization benchmark suite, CacheBench is designed to check reminiscence and cache bandwidth efficiency and depends on a compilation of C++ Toolchains and compilers.

Learn on for extra evaluation.