SK Hynix and AMD have been on the forefront of the reminiscence business with the primary technology of excessive bandwidth reminiscence (HBM) again in 2013 – 2015, and SK Hynix continues to be main this market when it comes to share. In a bid to take care of and develop its place, SK Hynix has to adapt to the necessities of its prospects, notably within the AI house, and to take action it is mulling over how one can make ‘differentiated’ HBM merchandise for big prospects.
“Growing customer-specific AI reminiscence requires a brand new strategy as the flexibleness and scalability of the know-how turns into important,” stated Hoyoung Son, the top of Superior Bundle Improvement at SK Hynix within the standing of a vice chairman
In terms of efficiency, HBM reminiscence with a 1024-bit interface has been evolving pretty quick: it began with a knowledge switch fee of 1 GT/s in 2014 – 2015 and reached upwards of 9.2 GT/s – 10 GT/s with the lately launched HBM3E reminiscence gadgets. With HBM4, the reminiscence is about to transit to a 2048-bit interface, which is able to guarantee regular bandwidth enchancment over HBM3E.
However there are prospects which can profit from differentiated (or semi-custom) HBM-based options, in line with the vice chairman.
“For implementing various AI, the traits of AI reminiscence additionally have to turn into extra diversified,” Hoyoung Son stated in an interview with BusinessKorea. “Our aim is to have a wide range of superior packaging applied sciences able to responding to those modifications. We plan to supply differentiated options that may meet any buyer wants.”
With a 2048-bit interface, many (if not the overwhelming majority) of HBM4 options will doubtless be {custom} or not less than semi-custom primarily based on what we all know from official and unofficial details about the upcoming customary. Some prospects would possibly wish to hold utilizing interposers (however this time they’ll get very costly) and others will desire to put in HBM4 modules instantly on logic dies utilizing direct bonding methods, that are additionally costly.
Making differentiated HBM choices requires refined packaging methods, together with (however actually not restricted to) SK Hynix’s Superior Mass Reflow Molded Underfill (MR-RUF) know-how. Given the corporate’s huge expertise with HBM, it could nicely give you one thing else, particularly for differentiated choices.
“For various kinds of AI to be realized, the traits of AI reminiscence additionally should be extra various,” the VP stated. “Our aim is to have a variety of superior packaging applied sciences to reply to the shifting technological panorama. Wanting forward, we plan to supply differentiated options to fulfill all buyer wants.”
Sources: BusinessKorea, SK Hynix
