TSMC on Friday formally opened its Superior Backend Fab 6 facility, which it is going to be utilizing to increase the corporate’s capability for constructing high-end, multi-chiplet merchandise. The power is claimed to be the primary all-in-one automated fab providing 3DFabric integration of front-end to back-end course of and testing providers.
TSMC’s Superior Backend Fab 6 can course of about a million 300-mm wafers per yr in addition to greater than 10 million hours of testing per yr. The manufacturing unit occupies 14.3 hectares in Zhunan Science Park and has a cleanroom that’s bigger than the mixed cleanroom areas of all different TSMC superior backend fabs, making it TSMC’s greatest superior packaging facility to this point, in accordance with the corporate.
TSMC mentioned that its Superior Backend Fab 6 is prepared for mass manufacturing of TSMC-SoIC (System on Built-in Chips) course of expertise, which incorporates such frontend 3D stacking methods as chip-on-wafer (CoW) and wafer-on-wafer (WoW). The fab can be designed to deal with superior backend packaging applied sciences, resembling built-in fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) which are used for chips like Apple’s M2 Extremely, AMD’s Intuition MI300, and NVIDIA’s A100 and H100.
“Chiplet stacking is a key expertise for bettering chip efficiency and cost-effectiveness. In response to the robust market demand for 3D IC, TSMC has accomplished early deployment of superior packaging and silicon stacking expertise manufacturing capability, and provides expertise management by the 3DFabric platform,” mentioned Dr. Jun He Vice President, Operations / Superior Packaging Expertise & Service, and High quality & Reliability.
Maybe essentially the most notable function of TSMC’s Superior Backend Fab 6 is complete five-in-one clever automated materials dealing with system that spans over 32 kilometers. The manufacturing info, ranging from the wafer stage to the die, is built-in with dispatching programs to hurry up the manufacturing cycle. This course of is augmented with AI to hold out exact course of management and real-time defect detection to maximise yields. That is significantly essential as if you package deal a multi-chiplet resolution like AMD’s MI300 any abnormality on the package deal stage instantly invalidates all of the chiplets which are on it inflicting a loss that prices not less than hundreds of {dollars}. The fab’s knowledge processing functionality per second is 500 occasions that of a typical front-end fab, which allows a radical manufacturing historical past for every die and permits the foundry to hint every die it processes on the fab.
“With the manufacturing capability that meets our clients’ wants, we’ll unleash innovation collectively and change into an essential companion that clients belief in the long run,” added Jun He.
